Integrating Vacuum Metallization with Form-In-Place (FIP) Dispensed Gaskets and RF Absorbers

Integrating Vacuum Metallization with Form-In-Place (FIP) Dispensed Gaskets and RF Absorbers is ideal for high-performance electronics, aerospace, automotive, telecommunications, and medical devices, which require superior EMI shielding, environmental sealing, and thermal management.

Here are some key benefits:

1. Enhanced EMI Shielding

  • Vacuum Metallization provides a conductive layer that grounds and shields electromagnetic waves for tailored EMI protection.

  • Form-In-Place (FIP) Gaskets with conductive fillers ensure a continuous conductive path and reliable seal.

  • RF Absorbers target specific frequencies to reduce cavity resonance and noise.

2. Superior Environmental Sealing

Form-In-Place (FIP) Dispensed Gaskets conform to irregular surfaces, providing a tight seal against dust, moisture, and contaminants, and maintain their properties across various temperatures and conditions.

3. Housing Weight Reduction

Optimize overall system weight for applications where weight sensitivity is crucial, including automotive, medical, and aerospace industries.

4. Design Flexibility

  • Vacuum Metallization allows precise placement on complex shapes.

  • FIP Gaskets accommodate intricate patterns and tight tolerances. Our FIP Gaskets can be placed as thin as 0.5mm.

  • RF Absorbers can be tailored to fit specific device areas. Our Automated RF Absorbers are available in sheet stock or potting epoxies with zero tolerance capabilities.

5. Cost-Effectiveness

  • Vacuum Metallization is a cost-effective conductive coating method.

  • FIP Gaskets reduce material waste and labor costs.
    Integrating these technologies simplifies assembly and lowers overall costs.

6. Enhanced Reliability and Durability

  • Vacuum Metallization provides an anti-oxidation protective layer to enhance weather resistance and long-term reliability.

  • RF Absorbers remain stable and effective over time.

7. Streamlined Manufacturing Process

Integrating these technologies reduces separate steps and components, with Automated FIP Gasket dispensing and precise metallization increasing production speed and consistency.

8. Customization and Adaptability

  • FIP Gaskets and RF Absorbers can be easily customized for different applications.

  • Vacuum Metallization adapts to various substrates and shapes, enhancing versatility.

Contact us now to explore how we can help you tackle the complex challenges of combining Vacuum Metallization, FIP Gaskets, and RF Absorbers: Sales@TennMax.com   

 
Vacuum MetallizationEsther Tseng