Performance first.
Thermal Interface Materials are specially treated high performance silicone elastomers. They are embedded with thermal conductive particles, creating a conforming filler for the gaps between thermal transfer surfaces, such as between microprocessors and heat sinks. Below is a glance of our Thermal Interface Materials:
Thermally Conductive Pad
Three different softness options provide the highest conformability under lower compression force. Tacky on both sides reduces contact thermal resistance.
Specialized Thermally
Conductive Dispensable Jelly
T-CIP series are are ideal for high-frequency RF applications, with long-term reliability ensuring performance in the harshest conditions.
Thermally Conductive
Dispensable Silicone Jelly
Designed to replace conventional thermal pads, these jellies save assembly time and reduce labor costs. Ultra soft and highly compressible properties protect force-sensitive components.
Thermally Conductive Pads
Can accurately place beads as small as 0.25 mm high. Through vigorous testing and rapid prototyping, we work with customers to overcome any accuracy challenge.
Multi-layer forming technology helps to get the balance of performance and handling while enabling engineers in design flexibility.
Specialized Thermally Conductive Dispensable Jelly
Easily dispensable and fast-curing at room temperature, this specialized material excels in vertical and high-vibration environments. It is ideally suited for high-frequency RF applications, with long-term reliability ensuring performance in the harshest conditions.
Thermally Conductive
Dispensable Silicone Jelly
GPF Tjelly materials are designed to replace conventional thermal pads for saving assembly time and labor cost. Ultra soft and highly compressible properties can protect force-sensitive components.
Pre-cured jelly, no mixing and curing needed
Auto-dispensable for high volume applications
Low compression force
