As versatile as they come.
One of our bestsellers - through rapid prototyping, our team designs FIP gaskets that reduce the amount and the size of screw holes to achieve smaller overall packaging. In addition, our FIP can be placed on PCB traces as thin as 0.5mm, creating more space for board components.
Filled with Nickel/Graphite, Ag/Cu, Ag/Al, Ag/Ni or other conductive particles, providing excellent electrical conductivity.
Unique conductive gasketing materials for specialty applications:
Silicone and fluorosilicone Form-in-Place gaskets designed for protection up to an IP68 rating.
Micro-Dispensing Technology
Precision is our top priority. Our dispensers can accurately place beads as small as 0.25 mm high. Through vigorous testing and rapid prototyping, we work with customers to overcome any accuracy challenge.